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ASMT-QxB2-Fxxxx
Super 0.5 W Power PLCC-4 Surface Mount LED Indicator
Data Sheet
Description
The Super 0.5 W Power PLCC-4 SMT LED is an extension of Power PLCC-4 SMT LEDs. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. The Super 0.5 W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin (except for red), to provide close uniformity. These LEDs are compatible with the IR solder reflow process. Due to the high reliability feature of these products, they also can be mounted using through-the-wave soldering process. Super 0.5 W Power PLCC-4 SMT LED is available in red, red orange and amber colors.
Features
* Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9 mm) * High reliability LED package due to enhanced silicone resin material * Mid-power intensity brightness with optimum flux performance using AllnGaP chip technologies * Available in Red, Red Orange and Amber colors * High optical efficiency * Available in 8 mm carrier tape and 7 inch reel * Low thermal resistance * Super wide viewing angle at 120 degrees * Longer life time with minimum degradation due to enhanced Silicone resin material * JEDEC MSL 2a
Applications
1. Exterior automotive * Turn signals * Side repeaters * CHSML * Rear combination lamp * Side markers * Truck clearance lamp 2. Electronic signs and signals * Channel lettering * Contour lighting * Indoor variable message sign 3. Office automation, home appliances, industrial equipment * Front panel backlighting * Push button backlighting * Display backlighting
CAUTION: ASMT-QxB2-Fxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
2.8 0.2 2.2 0.2 C C 2.40 1.9 0.2 0.8 0.1 0.15 (TYP.) 1.15 0.05
3.2 0.2
3.6 0.2
0.41 (TYP.) 0.56 (TYP.)
0.8 0.3 A ANODE MARKING NOTES: 1. 2. 3. 4. A 0.7 0.1 0.5 0.1 2.30 0.05
ALL DIMENSIONS IN MILLIMETERS. LEAD POLARITY AS SHOWN IN FIGURE 12. TERMINAL FINISH: Ag PLATING. ENCAPSULATION MATERIAL: SILICONE RESIN.
Figure 1. Package drawing
Table 1. Device Selection Guide
Luminous Flux, FV[1] (lm) Color Amber Red Orange Red Part Number ASMT-QAB2-FDE0E ASMT-QHB2-FEF0E ASMT-QRB2-FCD0E Min. Flux (lm) 9.0 11.5 7.0 Typ. Flux (lm) 11.4 14.0 9.8 Max. Flux (lm) 15.0 19.5 11.5 Test Current (mA) 150 150 150 Dice Technology AlInGaP AlInGaP AlInGaP
Notes: 1. FV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = 12%.
Part Numbering System
A S M T - Q X1 B 2 - F X2 X3 X4 X5 Packaging Option Color Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color
2
Table 2. Absolute Maximum Ratings (TA = 25C)
Parameters DC Forward Current[1] Peak Forward Current[2] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature ASMT-QxB2-Fxxxx 150 mA 200 mA 470 mW 5V 125C -40C to +110C -40C to +110C
Notes: 1. Derate l inearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz.
Table 3. Optical Characteristics (TA = 25C)
Dominant Viewing Luminous Luminous Wavelength Angle 2q1/2[2] Efficacy hV[3] Efficiency lD[1] (nm) (Degrees) (lm/W) he(lm/W) Typ. 120 120 120 Typ. 450 210 170 Typ. 28 35 21 594.5 617.0 624.0 Luminous Intensity /Total Flux[4,5] IV (mcd) / V Fn (lm) Typ. 0.30 0.30 0.30
Color Amber Red
Part Number
Dice Technology Typ.
ASMT-QAB2-Fxxxx AlInGaP ASMT-QRB2-Fxxxx AlInGaP
Red Orange ASMT-QHB2-Fxxxx AlInGaP
Notes: 1. The dominant wavelength, lD, is derived from the CIE Chromaticity diagram and represents the color of the device. 2. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = IV/hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 4. Fn is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions.
Table 4. Electrical Characteristics (TA = 25C)
Forward Voltage VF (Volts) @ IF = 150 mA Part Number ASMT-QAB2-Fxxxx ASMT-QHB2-Fxxxx ASMT-QRB2-Fxxxx Typ. 2.70 2.70 3.10 Max. 3.25 3.25 3.55 Reverse Voltage VR @ 100 A Min. 5 5 5 60 60 60 Thermal Resistance RqJ-P (C/W)
3
1.0 0.9 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 AlInGaP AMBER
AlInGaP RED-ORANGE AlInGaP RED
680
730
780
WAVELENGTH - nm
Figure 2. Relative intensity vs. wavelength
200 180 FORWARD CURRENT - mA 160 140 120 100 80 60 40 20 0 0
AlInGaP AMBER RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 150 mA)
1.2 1.0 0.8 0.6 RED/RED-ORANGE 0.4 0.2 0
AMBER
AlInGaP RED AlInGaP RED-ORANGE 1 2 3 4
0
50
100
150
200
FORWARD VOLTAGE - V
DC FORWARD CURRENT - mA
Figure 3. Forward current vs. forward voltage
Figure 4. Relative intensity vs. forward current
2.2 MAXIMUM FORWARD CURRENT - mA 2.0 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 25 C) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -50 -25 0 25 50 75 100 125 RED AMBER RED-ORANGE
160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120
RJA = 100C/W RJA = 110C/W RJA = 130C/W RJA = 80C/W
JUNCTION TEMPERATURE - C
AMBIENT TEMPERATURE - C
Figure 5. Relative intensity vs. temperature
Figure 6a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125C, RqJ-A = 130C/W, 110C/W, 100C/W and 80C/W.
4
160
RJP = 60C/W
630 AlInGaP RED DOMINANT WAVELENGTH - nm 620 AlInGaP RED-ORANGE 610 600 AlInGaP AMBER 590 580
140 120 CURRENT - mA 100 80 60 40 20 0 0 20 40 60 80 100 120
0
50
100
150
200
TEMPERATURE - C
FORWARD CURRENT - mA
Figure 6b. Maximum forward current vs. solder point temperature. Derated based on TJMAX = 125C, RJP = 60C/W.
Figure 7. Dominant wavelength vs. forward current - AlInGaP devices
0.15 FORWARD VOLTAGE SHIFT (V) 0.10 NORMALIZED INTENSITY -25 0 25 50 75 100 0.05 0 -0.05 -0.10 -0.15 -50
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 90
TJ - JUNCTION TEMPERATURE - C
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Forward voltage shift vs. temperature
Figure 9. Radiation pattern
10 - 30 SEC. 255 - 260 C 217 C 200 C 150 C 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. 3 C/SEC. MAX. -6 C/SEC. MAX.
D
TEMPERATURE
TIME (Acc. to J-STD-020C)
Note: Diameter "D" should be smaller than 2.2mm
Figure 11. Recommended Pb-free reflow soldering profile Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
Figure10. Recommended pick and place nozzle size
5
2.4 0.6 0.9 X 6
1.3 x 6 C C C C
0.4 1.4
A
A
4.6
A ANODE MARKING
A
A
A
0.3
SOLDER MASK A C ANODE CATHODE ANODE MARKING
MINIMUM 55 mm2 OF ANODE PAD FOR IMPROVED HEAT DISSIPATION
Figure 12. Recommended soldering pad pattern
TRAILER 200 mm MIN. FOR 180 REEL. 200 mm MIN. FOR 330 REEL.
COMPONENT
LEADER 480 mm MIN. FOR 180 REEL. 960 mm MIN. FOR 330 REEL.
C
A
USER FEED DIRECTION
Figure 13. Tape leader and trailer dimensions
6
1.5
+ 0.1 -0
4 0.1
2 0.05
B
1.75 0.1
3.6 0.1
A
A
5.5 0.05 12 + 0.3 - 0.1 3.8 0.1
C
C
A 1 + 0.1 -0 B 3.45 0.1
A
8 0.1
0.229 0.01 VIEW B-B
VIEW A-A ALL DIMENSIONS IN mm.
Figure 14. Tape dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 15. Reeling orientation
7
Device Color (X1)
A H R Amber Red Orange Red
Color Bin Select (X4)
Individual reel will contain parts from one full bin only. X4 0 A B Full Distribution 1 and 2 only 2 and 3 only 3 and 4 only 4 and 5 only 5 and 6 only 1, 2 and 3 only 2, 3 and 4 only 3, 4 and 5 only 4, 5 and 6 only 1, 2, 3 and 4 only 2, 3, 4 and 5 only 3, 4, 5 and 6 only 1, 2, 3, 4 and 5 only 2, 3, 4, 5 and 6 only Special Color Bin
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only. X2 X3 Min Flux Bin Max Flux Bin
C D E G H J
Flux Bin Limits
Bin ID A B C D E F G H I J K Min. (lm) 4.30 5.50 7.00 9.00 11.50 15.00 19.50 25.50 33.00 43.00 56.00 Max. (lm) 5.50 7.00 9.00 11.50 15.00 19.50 25.50 33.00 43.00 56.00 73.00
K M N P R S Z
Color Bin Limits
Amber/Yellow 2 3 4 5 6 Red Orange 1 2 3 Red Full Distribution Min. (nm) 583.0 586.0 589.0 592.0 595.0 Min. (nm) 611.0 616.0 620.0 Min. (nm) 620.0 Max. (nm) 586.0 589.0 592.0 595.0 598.0 Max. (nm) 616.0 620.0 625.0 Max. (nm) 635.0
Tolerance of each bin limit = 12%.
Tolerance of each bin limit = 1 nm.
8
VF Binning
Bin 2D 2E 2F 2G 2H 2J 2K 2L Min. 2.35 2.50 2.65 2.80 2.95 3.10 3.25 3.40 Max. 2.50 2.65 2.80 2.95 3.10 3.25 3.40 3.55
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all times and all high temperature related processes, including soldering, curing or rework, need to be completed within 672 hours. C. Control for unfinished reel - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB needs to be stored in sealed MBB with desiccant or desiccator at <5% RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C/60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 60 5C for 20 hours.
Tolerance of each bin = 0.1 V.
Packaging Option (X5 )
Option E Test Current 150 mA Package Type Top Mount Reel Size 7 Inch
Handling Precaution
The encapsulation of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. This might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detailed information.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. AV02-0232EN - July 3, 2007

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